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sixteen-channel, 75m a current sink with current match AP3616 data sheet 1 bcd semiconductor manufacturing limited jul. 2012 rev. 1. 2 general description the AP3616 is an sixteen-channel constant current sink with current match used for led driver. it uses an external resistor to set the current for sixteen led strings with an accuracy of 1.5%. the full scale led current can be adjusted fr om 20ma to 75ma for each channel. the led lightness can be adjusted by pwm dimming function. the device can keep worki ng normally without any damage when leds are short or open. it features under voltage lockout protection and over temperature pro- tection. the AP3616 has three interface terminals (fb, syn and fbx pins). the fb and syn pins allow the device to work with a dc/dc conv erter to drive led arrays for good performance. and the fbx pin enables the device to be connected in parallel. the AP3616 is available in soic-28 and hsop-28 packages. features input voltage range: 4.2v to 27v maximum output current: typical 1.2a (75ma per channel) current match accuracy (typical): 1.5% pwm / linear dimming control open led self-check and protection flexible short led protection under voltage lockout protection over temperature protection fbx and syn pins enable parallel application over voltage protection applications lcd display modules lcd monitor lcd tv figure 1. package types of AP3616 soic-28 hsop-28
sixteen-channel, 75m a current sink with current match AP3616 data sheet 2 bcd semiconductor manufacturing limited jul. 2012 rev. 1. 2 figure 2. pin configuration of AP3616 (top view) pin configuration (soic-28) m package (hsop-28) m28 package 1 2 3 4 5 6 7 8 10 12 28 27 26 25 24 23 22 21 19 17 9 20 11 18 14 13 15 16 ch1 ch2 ch3 ch4 ch5 ch6 ch7 ch8 flag fb fbx en vin gnd ch9 ch10 ch11 ch12 ch13 ch14 ch15 ch16 ovp scp syn synf dim iset 3 1 2 4 5 6 7 10 8 9 11 12 13 14 19 21 20 18 17 16 15 26 28 27 25 24 23 22 ch1 ch2 ch3 ch4 ch5 ch6 ch7 ch8 ch9 ch10 ch11 ch12 ch13 ch14 ch16 ovp scp syn synf dim iset gnd vin en fbx fb flag ch15
sixteen-channel, 75m a current sink with current match AP3616 data sheet 3 bcd semiconductor manufacturing limited jul. 2012 rev. 1. 2 pin number pin name function soic-28 hsop-28 1 to 8 28 to 21 1 to 8 9 to 15 & 28 ch1 to ch8 ch9 to ch16 white led cathode connection pins. if not used, leave them uncon- nected 916flag error flag pin. when led load goes to error (short or open ), the flag open drain output will close 10 17 fb feedback pin. this pin is an in terface terminal, which samples the voltage of each channe l, and outputs the lowest voltage of the string to dc/dc converter 11 18 fbx this pin is an interface terminal . connect it to fb pin can achieve parallel applicati on. if not used, leave it unconnected 12 19 en enable pin. logic high enables the ic and logic low disables the ic 13 20 vin input voltage pin 14 21 gnd ground pin 15 22 iset led current setting pin. an external resistor is connected to this pin. current on each channel can be expressed by i chan- nel =1.194*1560/r iset 16 23 dim dimming control pin. a dding a pwm signal or dc signal to this pin to control led dimming. connect it to high voltage level if not used 17 24 synf synchronous pwm frequency setting pin. a nf level of capacitor should be connected to this pin to set pwm frequency at about 80hz to 25khz 18 25 syn pwm dimming synchronous pin, th is pin outputs dc transformed pwm signal to synchronize parall el AP3616 and power converter, if not used, leave it unconnected 19 26 scp led short trigger voltage setting pin. this pin is used to set the led short circuit protec tion voltage level 20 27 ovp this pin is used to trigger ov p condition. ovp triggering voltage should be lower than the ovp voltage of its cascade chip, such as , ap3039a in figure 19 pin description
sixteen-channel, 75m a current sink with current match AP3616 data sheet 4 bcd semiconductor manufacturing limited jul. 2012 rev. 1. 2 en bandgap uvlo vdd regulator en vin gnd agnd pgnd iset amp synf comp comp + _ + _ 2.2v 0.5v rs set reset 13 a q_bar comp dim syn comp ovp v ref scp comp comp + _ + _ vdd 0.26v sel low fbx fb v ch 16 to 1 ch_i ref 1 to 16 flag v ref ch16 ch1 amp ch1_i ref x1 x4 pgnd open led short led vdd comp scp v dd =5v 2 a agnd agnd x7 scp latch block vds1 v ds1 =v dd 200mv comp open detection short detection scp open detection x3120 x1 x1 ovp_en pwm v ref 9(16) 10(17) 11(18) 12(19) 13(20) 14(21) 15(22) 17(24) 16(23) 18(25) 19(26) 20(27) 1 8 28 21 x4 13 a 1.194v 1 8 9 15 ( & 28 ( a(b) a for soic-28 b fro hsop-28 functional block diagram figure 3. functional block diagram of AP3616
sixteen-channel, 75m a current sink with current match AP3616 5 bcd semiconductor manufacturing limited data sheet jul. 2012 rev. 1. 2 ordering information package temperature range part number marking id packing type soic-28 -40 to 85 o c AP3616m-g1 AP3616m-g1 tube hsop-28 AP3616m28-g1 AP3616m28-g1 tube circuit type package g1: green bcd semiconductor's pb-free products , as designated with "g1" suffix in the part number, are rohs compliant and green. parameter symbol value unit input voltage v in 30 v flag pin voltage v flag 30 v en pin voltage v en 30 v voltage on each channel v chx -0.3 to 60 v voltage on other seperate pins -0.3 to 6 v thermal resistance (junction to ambient, no heat sink) soic-28 ja 72 o c/w hsop-28 59 o c/w operating junction temperature t j 150 o c lead temperature (soldering, 10sec) t stg -65 to 150 o c esd (human body model) 2000 v esd (machine model) 200 v note 1: stresses greater than those listed under "absolute maximum ratings" may cause perm anent damage to the device. these are stress ratings only, and functional operation of the de vice at these or any other c onditions beyond those indicated under "recommended operating conditions" is not implied. exposure to "absolute maximum ratings" for extended periods may affect device reliability. absolute maximum ratings (note 1) blank: tube m: soic-28 AP3616 - m28:hsop-28
sixteen-channel, 75m a current sink with current match AP3616 data sheet 6 bcd semiconductor manufacturing limited jul. 2012 rev. 1. 2 parameter symbol min max unit input voltage v cc 4.2 27 v recommended pwm dimming frequency f pwm 0.08 25 khz full scale setting current per channel v chx =0.5v i chx 20 40 ma v chx =0.8v 20 60 v chx =1.2v 20 75 operating temperature range t a -40 85 o c recommended operating conditions electrical characteristics parameter symbol conditions min typ max unit vcc section quiescent current i q iset, syn and fb pin floating 24ma shutdown supply current i stby v en =0v, iset,syn and fb pin floating 0.1 1 a under voltage loc kout threshold v uvlo vin falling edge 3.65 3.9 4.15 v under voltage lockout hysteresis v uvlo_hys 300 mv channel section maximum output current per channel i chx_max v chx = 0.8v, r iset =0 75 ma current sink saturation voltage per channel v chx_sat i chx =60ma 0.6 v current matching accuracy between any two channels i ch_matching i chx =60ma, v ch =0.8v 3% output current load regulation v chx =0.5v to 2.8v 4 % output current line regulation (note 2) v chx =4.2v to 2.8v 2 %/v v in =24v, v en =5v, t a =25 o c, unless otherwise specified. boldface type apply over the full operating tempera- ture range (t a =-40 o c to 85 o c ). note 2: guaranteed by design (gbd).
sixteen-channel, 75m a current sink with current match AP3616 7 bcd semiconductor manufacturing limited data sheet jul. 2012 rev. 1. 2 parameter symbol conditions min typ max unit dimming section pwm high level threshold voltage v ih_pwm 2.5 v pwm low level threshold voltage v il_pwm 0.3 v linear dimming level v l_dim 0.5 2.2 v led short protection section scp current i scp 10.5 12.5 14.5 a current sink section iset reference voltage v iset r iset =30k, ch1 to ch16 floating 1.170 1.194 1.218 v i chx /i set current multiplication ratio k r iset =30k, v chx =1v 1615 enable section en pin high level threshold v ih_en 2.0 v en pin low level threshold v il_en 0.8 v ovp section threshold voltage v threshold 1.130 1.194 1.250 v flag section saturation voltage v sat i sink =2ma 0.3 v syn section pwm frequency f pwm 0.08 25 khz synf high level output voltage v out_h 2.4 v synf low level output voltage v out_l 0.4 v fb section feedback output current i fb v fb drop to 97% 13 17 a total device thermal shutdown temperature t otsd chx pin left foating 160 o c thermal shutdown hysteresis t hys 20 o c electrical characteristics (continued) v in =24v, v en =5v, t a =25 o c, unless otherwise specified. boldface type apply over the full operating tempera- ture range (t a =-40 o c to 85 o c ).
sixteen-channel, 75m a current sink with current match AP3616 data sheet 8 bcd semiconductor manufacturing limited jul. 2012 rev. 1. 2 figure 4. maximum channel current vs. channel voltage figure 5. feedback voltage vs. feedback current typical performance characteristics v in =24v, v en =5v, r iset =30k ? ,, t a =25 o c, unless otherwise specified. figure 6. channel current vs. linear dimming voltage figure 7. current per channel vs. duty cycle 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 20 40 60 80 100 120 140 160 180 200 maximum channel current (ma) channel voltage (v) 4 6 8 10 12 14 16 18 20 0.40 0.42 0.44 0.46 0.48 0.50 0.52 0.54 0.56 feedback voltage (v) feedback current ( a) 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 10 20 30 40 50 60 70 current per channel (ma) linear dimming voltage (v) 0 102030405060708090100 -5 0 5 10 15 20 25 30 35 40 45 50 55 60 65 current per channel (ma) duty cycle (%) f=100hz f=20khz (pwm dimming)
sixteen-channel, 75m a current sink with current match AP3616 9 bcd semiconductor manufacturing limited data sheet jul. 2012 rev. 1. 2 typical performance characteristics (continued) v in =24v, v en =5v, r iset =30k ? ,, t a =25 o c, unless otherwise specified. -50 -25 0 25 50 75 100 125 150 55 56 57 58 59 60 61 62 63 64 65 channel current (ma) temperature ( o c) figure 8. channel current vs. temperature figure 9. iset reference voltage vs. temperature -50 -25 0 25 50 75 100 125 150 0.8 0.9 1.0 1.1 1.2 1.3 1.4 iset reference voltage (v) temperature ( o c) figure 10. saturation voltage vs. temperature figure 11. quiescent current vs. input voltage -50 -25 0 25 50 75 100 125 150 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 saturation voltage (v) temperature ( o c) 3 6 9 12 15 18 21 24 27 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 quiescent current (ma) input voltage (v)
sixteen-channel, 75m a current sink with current match AP3616 data sheet 10 bcd semiconductor manufacturing limited jul. 2012 rev. 1. 2 0 2 4 6 8 10 12 14 16 60.0 60.2 60.4 60.6 60.8 61.0 61.2 61.4 61.6 61.8 62.0 62.2 62.4 62.6 62.8 63.0 63.2 63.4 63.6 current per channel (ma) channel t a =-40 o c t a =125 o c t a =25 o c typical performance characteristics (continued) v in =24v, v en =5v, r iset =30k ? ,, t a =25 o c, unless otherwise specified. figure 12. current per channel vs. channel figure 13. pwm dimming (f=100hz, duty cycle=50%) v dim 5v/div v syn 5v/div v gate 10v/div i ch 50ma/div time 4ms/div v dim 5v/div v syn 5v/div v gate 10v/div i ch 50ma/div figure 14. pwm dimming (f=20khz, duty cycle=50%) figure 15. linear dimming (v dim =1.4v) time 20 s/div v synf 1v/div v syn 5v/div v gate 10v/div i ch 100ma/div time 800 s/div
sixteen-channel, 75m a current sink with current match AP3616 11 bcd semiconductor manufacturing limited data sheet jul. 2012 rev. 1. 2 typical performance characteristics (continued) v in =24v, v en =5v, r iset =30k ? ,, t a =25 o c, unless otherwise specified. v ovp 1v/div v flag 5v/div v fb 1v/div i ch 50ma/div figure 16. led open protection figure 17. led short protection time 400 s/div v scp 1v/div v flag 5v/div v ch 5v/div i ch 100ma/div time 4 s/div v gate 5v/div i ch 50ma/div time 2s/div figure 18. otp and recovery
sixteen-channel, 75m a current sink with current match AP3616 data sheet 12 bcd semiconductor manufacturing limited jul. 2012 rev. 1. 2 function description 1. led current setting the maximum led current per channel can be adjusted up to 75ma via iset pin. when 75ma current is needed in applicat ion, two or more channels can be paralleled to provid e larger drive current. con- nect a resistor r iset between iset pin and gnd to set the reference current i set . the led current is determined by the following equation. 2. dimming control the AP3616 provides two dimming methods: external pwm signal or dc voltage input. applying a pwm signal to dim pin to adju st the led current, that means, the led current of all enabled channels can be adjusted at the same time and the led brightness can be adjusted from 1%*i chx_max to 100%*i chx_max . during the high level period of pwm signal, the led is turned on and 100% of the current flows through led, while during the low level period of the pwm signal, the led is turned off and almost no current flows through the led, thus changing the average current through led and finally adjusting led brightness. the external pwm signal frequency applied to pwm pin is allowed to be 80hz or higher. 3.over voltage protection the AP3616 integrates an ovp circuit. the ovp pin is connected to the center tap of voltage-divider (r ov3 and r ov4 ) that placed between high voltage output and gnd (figure 19). if the voltage on ovp pin exceeds 1.194v, which may results from open loop or excessive output voltage, the AP3616 will start led open protection. 4. led short-circuit protection the AP3616 integrates an led short-circuit protection circuit. during normal operation, any short- circuited led will cause th e corresponding led pin voltage to rise. if any led pin voltage exceeds 8 times of the voltage at scp pin, the corresponding led current sink will be latched off, while the remaining string(s) keep normal operation. toggle the vin and/or en to reset the latch. an internal current source was connected to this pin, a resistor connected here is used to set the shorting led trigger voltage. 5. led open-circuit protection the AP3616 integrates an led open-cir cuit protec- tion circuit. when any led string is open, v out will boost up until the voltage at ovp pin reaches an approximate 1.194v threshold. the ic will automati- cally ignore the open string(s) whose chx pin voltage is less than 100mv. ) ( 194 . 1 0 156 ) ( ) ( ? = ? ? = k r k r v k ma i iset iset iset led ov4 ov4 ov3 ovp r v 194 . 1 ) r (r v + =
sixteen-channel, 75m a current sink with current match AP3616 13 bcd semiconductor manufacturing limited data sheet jul. 2012 rev. 1. 2 u1 +24v (v cc ) c in1 22 f/50v c in2 c in3 r uvlo_1 20k ovp1 r1 en r uvlo_2 2.7k c v 0.47 f/25v r g ap3039a r t 100k r4 100k r cs1 r cs2 r c 3.9k c c 10nf/16v uvlo ov en vin vcc out gnd rt cs gnd +24v l 47 h/4a shdn fb comp ss r2 r3 c1 d mbrd360 60v/3a c out1 10 f/100v r ov3 c out2 10 f/100v v out r ov1 ovp1 ovp2 r ov2 4.3k r ov4 4.3k v cc =24v c2 0.1 f/50v r7_1 130k c3_1 6.8nf r8_1 51 r9_1 1k +5v ovp2 syn fb vin iset gnd scp synf en flag ovp dim fbx ch1 ch2 ch16 fqd13n06l 60v/11a AP3616 r11_1 (optional) c4 c ss 22nf/16v 300m 300m r5 62k 1 2 3 4 5 6 78 9 10 11 12 13 14 (optional) (optional) (optional) (optional) r6 30k r7 130k c3 6.8nf r8 51 r9 1k +5v ovp2 syn fb vin iset gnd scp synf en flag ovp dim fbx ch1 ch2 ch16 AP3616 v cc =24v c2 0.1 f/50v en u2 u3 r10 51 pwm pwm / linear dimming (optional) 51 200k 150k led arrays 12x32 1 f r6_1 30k typical application single chip application (12s16p) figure 19. typical applications of AP3616 multi chips application (12s32p) u1 +24v (v cc ) c in1 22 f/50v c in2 c in3 r uvlo_1 20k ovp1 r1 en r uvlo_2 2.7k c v 0.47 f/25v r g ap3039a r t 100k r4 100k r cs1 r cs2 r c 3.9k c c 10nf/16v uvlo ov en vin vcc out gnd rt cs gnd +24v l 47 h/4a shdn fb comp ss r2 r3 c1 d mbrd360 60v/3a c out1 10 f/100v r ov3 c out2 10 f/100v v out r ov1 ovp1 ovp2 r ov2 4.3k r ov4 4.3k v cc =24v c2 0.1 f/50v r6 30k r7 130k c3 6.8nf r8 51 r9 1k en +5v ovp2 r10 51 pwm syn fb vin iset gnd scp synf en flag ovp dim fbx ch1 ch2 ch16 fqd13n06l 60v/11a AP3616 r10 (optional) c4 c ss 22nf/16v 2 300m 300m r5 62k 1 2 3 4 5 6 78 9 10 11 12 13 14 pwm / linear dimming (optional) (optional) (optional) (optional) 1 f 51 (optional) 200k 150k led arrays 12x16 ? ? ? ? ? ? 2 ? ? ? ? ? ? ?
sixteen-channel, 75m a current sink with current match AP3616 data sheet 14 bcd semiconductor manufacturing limited jul. 2012 rev. 1. 2 mechanical dimensions soic-28 unit: mm(inch) 0 17.700(0.697) 18.100(0.713) 10.210(0.402) 10.610(0.418) 7.400(0.291) 7.700(0.303) 1.270(0.050) bsc 0.330(0.013) 0.510(0.020) 2.350(0.093) 2.650(0.104) 2.290(0.090) 2.500(0.098) 0.100(0.004) 0.300(0.012) 0.400(0.016) 1.270(0.050) 0.204(0.008) 0.330(0.013) 8 note: eject hole, oriented hole and mold mark is optional.
sixteen-channel, 75m a current sink with current match AP3616 data sheet 15 bcd semiconductor manufacturing limited jul. 2012 rev. 1. 2 17.890(0.704) 0.204(0.008) 0 o 8 o 18.190(0.716) 0.360(0.014) 0.400(0.016) 1.270(0.050) 10.000(0.394) 10.650(0.419) 7.400(0.291) 7.600(0.300) 0.230(0.009) 0.470(0.019) 0.100(0.004) 0.300(0.012) 2.280(0.090) 2.630(0.104) 2.180(0.086) 2.330(0.092) 0.800(0.031) typ 5.050(0.199) 5.250(0.207) note: eject hole, oriented hole and mold mark is optional. hsop-28 unit: mm(inch) mechanical dimensions (continued)
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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